HDI PCB

Experience the Cutting-Edge Technology of HDI PCBs for Unparalleled Precision and Performance

HDI PCB

HDI(high-density interconnect) PCBs are advanced circuit boards designed with complex and intricate features that allow for high-density routing and component placement. These boards utilize microvias, fine lines, and small vias to maximize the available space on the board, resulting in reduced size, improved performance, and enhanced functionality. With our state-of-the-art manufacturing facilities and cutting-edge technology, we specialize in producing HDI PCBs that cater to a wide range of applications, including smartphones, tablets, wearables, automotive electronics, and medical devices. Our team of skilled engineers and technicians meticulously design and fabricate HDI PCBs, ensuring the highest levels of precision, reliability, and quality.

By partnering with Bester for your HDI PCB needs, you can expect superior performance, exceptional signal integrity, and improved thermal management. With our commitment to innovation and customer satisfaction, we strive to deliver HDI PCBs that exceed expectations and drive the success of your electronic products. Trust Bester for all your HDI PCB requirements and experience the difference in quality and service that sets us apart from the competition.

A Leading HDI PCB Manufacturer

Over the course of a decade in business, Bester has established a hard-earned reputation for manufacturing PCBs of the highest quality. Our custom PCB manufacturing capabilities enable you to get the finest quality HDI PCBs at competitive prices without min order quantity requirement. Our team run design for manufacture check on your custom PCB file and consult with you to ensure it is ready for manufacturing and that your boards will meet your performance requirements. We also have an on-site quality control department to verify the finished product meet your high quality standards.

质量等级: 标准 IPC 2
层数: 4 - 24 层
订购数量: 1 件 - 10000+ 件
建造时间: 2 天 - 5 周
材料: FR4 标准 Tg 140°C、FR4 高 Tg 170°C、FR4 和罗杰斯复合层压材料
电路板尺寸: 最小 6*6 毫米 | 最大 457*610 毫米
板厚: 0.4 毫米 - 3.0 毫米
铜重（成品）: 0.5 盎司 - 2.0 盎司
最小跟踪/间距: 2.5mil/2.5mil
阻焊面: 根据文件
阻焊层颜色: 绿、白、蓝、黑、红、黄
丝网印刷面: 根据文件
丝印颜色: 白、黑、黄
表面处理: HASL – Hot Air Solder Leveling, Lead Free HASL – RoHS, ENIG – Electroless Nickle/Immersion Gold – RoHS, Immersion Silver – RoHS, Immersion Tin – RoHS, OSP – Organic Solderability Preservatives – RoHS
最小环形圈: 4mil, 3mil - 激光钻孔机
最小钻孔直径: 6mil, 4mil - 激光钻孔机
盲孔/埋孔的最大指数: 堆叠过孔用于 3 层互连，交错过孔用于 4 层互连
其他技术: Flex-rigid combination, Via In Pad, Buried Capacitor (only for Prototype PCB total area ≤1m²)