What is Maximum Plated Through-hole Size

What is Maximum Plated Through-hole Size

Maximum plated through-hole size refers to the largest allowable diameter for a hole in a printed circuit board that is intended to have a conductive material plated through it. This size is determined by considering various factors, including the minimum annular ring, standard fabrication allowance, and specific requirements for different levels and types of pads.

Several related terms and calculations come into play to calculate the maximum plated through-hole size. These include the minimum annular ring, which refers to the distance between the edge of a drilled hole and the edge of the copper pad surrounding it. The standard fabrication allowance accounts for manufacturing tolerances and variations. Additionally, different levels and types of pads have specific requirements that influence the maximum allowable hole size.

The maximum plated through-hole size is typically calculated by adding the specified hole size before plating to the manufacturing tolerance, and then subtracting twice the minimum plating thickness. This ensures the hole is large enough to accommodate the plated material while meeting the necessary design and manufacturing requirements.