What is Laminate Void
A Laminate void refers to the absence of epoxy resin within a cross-sectional area where it would typically be present in a PCB. During the lamination process of a PCB stack-up, lamination voids can occur at the interface of bonding materials. These voids can also be caused by issues with the raw materials used in the PCB manufacturing process. When a laminate void occurs, it can lead to delamination between the dielectric and copper foil layers, forming cracks in the inner layers of the PCB. These voids can compromise the PCB’s structural integrity and electrical performance, making them undesirable in the manufacturing process.
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