What is Metal Clad Base Material
Metal clad base material refers to the foundational layer of a metal clad PCB, which is typically composed of aluminum and serves as a conductor of heat. The metal clad base material provides a solid base for the copper foil and dielectric layers in the PCB structure.
The metal clad base material isolates the aluminum base layer from the copper foil. This isolation is essential to prevent any electrical interference or short circuits between the two components. Additionally, the metal clad base material plays a vital role in facilitating the efficient transfer of heat between the aluminum base layer and the copper foil.
The thickness of the metal clad base material can vary, typically ranging from 1 mm to 3.2 mm, depending on the specific requirements of the PCB design and desired thermal properties. Aluminum is commonly chosen as the material for the metal clad base due to its excellent thermal conductivity properties.
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