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원스톱 PCBA 제조업체/용어집

PCB 용어집

Terms and glossary in PCB & PCBA industry.

무료 견적 받기

A

Acceptance Quality Level (AQL)Acceptance Test Access Holes Accuracy Acrylic Resin Activating Active Component Additive Process Adhesion Layer Adhesive Aging AIN Air Gap Algorithm Alkyd AlN Substrate Alumina 알루미늄 PCB Ambient American National Standards Institute (ANSI)American Wire Gauge (AWG)Analog Circuit Analog Circuit Simulator Analog Functional Test Analog In-circuit Test Analytical Services Lab Anchoring Spur Annotation Annular Ring Anode Anti-Solder Ball Any Layer Interstitial Via Hole (ALIVH)Aperture Aperture Information Aperture List Aperture Table Aperture Wheel Aqueous Cleaning Arc Resistance Array Array Rails Array X Dimension Array Y Dimension Artwork Artwork Master AS9100 ASCII ASCII Text 화면 비율 Assembly Assembly Drawing Assembly File Assembly House Assembly Language ASTM ATE Auto Router AutoCAD Automated Component Insertion 자동 광학 검사(AOI)Automated Test Equipment (ATE)Automatic Component Placement Automatic X-Ray Inspection (AXI)Axial Lead Azeotrope

B

B-Stage B-Stage Material B-Stage Resin Back Drilling Backdriving Backpanel (Backplane)Backup Material Ball Grid Array (BGA)Bare Board Bare Board Test (BBT)Barrel Base Base Copper Base Copper Weight Base Laminate Base Material Base Material Thickness Base Solderability Basic Wettability Beam Lead Bed of Nails Bed of Nails Fixture Bellows Contact Bevel Beveled Edge Beveling BGA Assembly Bill of Materials Bill of Materials (BOM)Black Pad Blind Via Blister Blow Hole Bluetooth 블러터 코트 Board Board Density Board House 보드 두께 Board Type (Single Unit and Panel)Board Vendor Body Gold Bond Lift-off Bond Strength Bonding Layer Bonding Time Border Area Border Data Bottom SMD Pad Boundary Scan Bow Branched Conductor Brazing Alloy Break-away 항복 전압 Breakout Bridged Joint Bridging BT-Epoxy Build Time (Lead Time)Build-up Buildability 내장형 자가 테스트(BIST)Bulge Buried Resistance Board Buried Via Burn-in Burr Bus Bus Bar Bypass Capacitor

C

C-Stage C-Stage Resin C4 Cable CAD file CAD system CAM File CAM Hold Capacitance Capacitive Coupling Capillary Action Capture Card-Edge Connector Cast Adhesive Castellated Hole Catalyst Cathode Cavity Process CEM-1 Center to Center Spacing Ceramic Ball Grid Array (CBGA)Ceramic Substrate Printed Board Chamfer Check Plots Chemical Conversion Coating Chemical Hole Clearing Chemically-deposited Printed Chip on Board 칩 Chip On Board (COB)Chip Scale Package (CSF)Chip Tester Circuit Circuit Board Circuit Card Circuit Card Assembly (CCA)Circuit Layer Circuit Tester Circumferential Separation Clad Clamshell Fixture Class 3 Clean Room Clearance Clearance Hole Clinched-wire through Connection Coated Copper Coating Coefficient of Expansion Coefficient of Thermal Expansion (CTE)Cold Solder Connection Collector Comparative Tracking Index (CTI)Compatibility Compiler Component Component Density Component Hole Component Kitting Component Library Component Side Component Sourcing Composite Epoxy Material (CEM)Computer Aided Design (CAD)Computer Aided Manufacturing (CAM)Computer Assisted Engineering (CAE)Computer Integrated Manufacturing (CIM)Computer Numerical Control (CNC)Conductive Adhesive Conductive Anodic Filament (CAF)Conductive Foil Conductive Pattern Conductor Conductor Base Width Conductor Layer Conductor Pattern Conductor Side Conductor Spacing 도체 두께 Conductor Width Conductor-to-Hole Spacing Conformal Coat Conformal Coating Connection Connectivity Connector 커넥터 영역 Connector Tongue Contact Angle Contact Area Contact Resistance Contact Spacing Continuity Continuity Testing Continuous Outline Control Code Controlled Depth Drilling Controlled Dielectric Controlled Impedance Coordinate Tolerance Copper (Finished Copper)Copper (Finished Copper) Weight Copper Clad Copper Clad Laminate (CCL)Copper Foil Copper Foil (Base Copper Weight)Copper Pour Copper Thieving 구리 무게 Core Thickness Corner Mark Corrosive Flux Cosmetic Defect Counterbore Counterbored Hole Countersink Coupon Cover Lay (Cover Coat)Cracking Crazing Creepage Crimp Contact Cross Hatching Cross-Linking Crosstalk CSP Cure Current Carrying Capacity Customer Part Number Cut Cut Lines Cut-and-clinch Cutouts 주기율

D

D Code Database Date Code Datum Datum Reference Daughter Board De-bugging De-wetting Decal Defect Delamination Dendrite Design for Assembly (DFA)Design for manufacturing (DFM)Design Review (NRE)Design Rule Design Rule Check (DRC)Design Rule Checking (DRC)Design Width of Conductor Desktop Stencil Desmear Destructive Testing Develop Device Dewetting Dezincification DFSM Dicyandiamide (DICY)Die Die Bonder Die Bonding Dielectric Dielectric Constant Dielectric Strength Differential Signal Differential Signaling Digital Circuit Digital Logic Simulator Digitizing Dimensional Stability Diode DIP Discrete Component Disturbed Solder Connection DNI DNP Document Retention 문서 DOS DOS-formatted Double-Sided Assembly Double-Sided Board Double-sided Component Assembly Double-sided Laminate Double-Sided PCB Double-Track Drag Soldering Drag-out Draw Draw Drill File (Excellon Drill File)Drill Hits Drill Tool Inspection Drilling Drills Dross Dry Film Dry Film Solder Mask (DFSM)Dry Film Soldermask Drying Time Dual Solder Wave Dummy Component Durometer DXF format Dynamic Random Access Memory (DRAM)

E

E-pad ECL Edge Bevel Edge Clearance Edge Connector Edge Dip Solderability Test Edge Plating Edge Spacing Edge-Board Connector Electrical Strength 전기 테스트 Electro Deposition 전기 전도성 페이스트 인쇄 기판 Electrode Deposition Electroless Copper Electroless Deposition Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG)Electroless Nickel Immersion Gold (ENIG)Electron-beam Bonding Electronic Component Electroplating Embedded Embedded Component Embedded Traces EMC Emitter Enclosures End-to-end Design End-to-end design Entry Material Environmental Stress Screening Epoxy Epoxy Resins Epoxy Smear ERBGF ERC ESD ESD Sensitivity ESR Etch Etch Back Etch Compensation Etch Factor ETCH Resist Etch-back Etchant Etched Printed Board Etching Excellon Excellon Drill File Exotherm 외부 레이어 Extra Press Cycles Extraneous Copper Eyelet

F

Fab Fabrication Fabrication Drawing 빠른 처리 Fibre Exposure Fiducial 신뢰 마크 File Submission 파일 Ivex Files Protel Fillet Film Artwork Fine Line Design Fine Pitch Finger Finished Copper First Article First Article Inspection First Pass Yield Fixed Frame Stencil Fixture Flash Gold Flat Flat Cable Flex Flex Circuit Flex PCB (Flexible PCB)Flexure Failure Flip Chip Flip Chip 플러드 바 Flow Soldering Fluorocarbon Flush Conductor 플럭스 Flux Residue Flux Residue Flying Probe 플라잉 프로브 테스터 플라잉 프로브 테스터 Foil Footprint Footprint Forced-Air Convection FPC OUTLINE PROCESSING FR-1 FR-2 FR-4 FR-406 FR-408 FR-6 Frameless Stencil 완전 추가 프로세스 기능 테스트(FCT)

G

G-10 Gas Blanket GC-Prevue Gerber File Gerber File Gerber Viewers GIL Grade MC3D GIL Grade MC3D 유리 전이 온도(Tg)Glob Top Go/No-Go Test Gold Finger Gold Plated Gold/Nickel Plating Gold/Nickel plating 골든 보드 Grid Ground Ground Plane Ground Plane Clearance Gull Wing Lead

H

HAL Half-Cut/Castellated Holes 하프 홀 PCB Halides Halogen-Free Halogenated Polyester Hard Copy Hard Gold HASL Finish HDI PCB Header 가열 및 당기기 Heat Sink 헤비 구리 PCB Hermetic High Density Interconnect (HDI)Hipot Test Hold-Down Tabs 구멍 Hole Breakout Hole Density Hole Location Hole Pattern Hole Pull Strength Hole Void Home Base Apertures Hot Air Solder Level (HASL)Hot Air Solder Leveling (HASL)HPGL Hybrid Hygroscopic

I

IC IEEE Image Imaging Immersion Coating 침수 도금 이머전 실버 이머전 주석 임피던스 임피던스 임피던스 제어 In-circuit Testing (ICT)Inclusion Individual Route Ink Inkjetting 내부 레이어 검사 로트 검사 오버레이 Institute for Interconnecting and Packaging Electronic Circuits (IPC)Insulation Resistance Integrated Circuits (IC)얼굴 간 연결 Inter-layer Connection Interconnect 상호 연결 스트레스 테스트 금속 간 화합물(IMC)Internal Layer Internal Power and Ground Layers Internal Signal Layers Interstitial Via Hole IPC Classification IPC-A-600 IPC-D-356 Isolation

J

J-리드 Jump Scoring Jumper Jumper Wire Just-in-time (JIT)

K

Kapton 카프톤 테이프 Keying Slot (Polarizing Slot)Keyway Known Good Board (KGB)

L

Laminate Laminate Thickness Laminate Void Laminating Press Lamination Land Land Pattern Landless Hole 레이저 직접 이미징 Laser Drilling Laser Photoplotter Laser soldering Lay-up Layer Layer Construction for Multilayer Designs Layer Sequence Layer-to-Layer Spacing LCCC Lead Free HASL 리드 프로젝션 Leakage Current Leakage Current 범례 LGA Library Lifted Land Lifted Land Line Line Space Line Width Liquation Liquid Photo-Imageable (LPI)액체 레지스트 Liquids Load Test Logic Diagram Loss Tangent Loss Tangent Lot

M

Major Defect Manhattan Distance Manhattan Length Manufacturability Manufacturer Part Number (MPN)제조 역량 Mark Mask Master Drawing Master Pattern PCB용 재료 Maximum Plated Through-hole Size MCM-L MCR Mean Time Between Failure (MTBF)Measling MELF Melting Range 멤브레인 스위치 Meniscus Metal Clad Base Material Metal Core Printed Circuit Board (MCPCB)Metal Electrical Face (MELF)금속 호일 Minimum Annular Ring (MAR)Minimum Conductor Width Molded Carrier Ring (MCR)

P

Panel Plating PCB 제작 노트(Fab 노트)PCB House PCBA Testing PCBA Testing Pitch Printed Circuit Board Assembly (PCBA)

S

Solder Balls Surface Mount Technology (SMT)

T

Tooling Hole 트레이스 및 공백 Turnkey Service

V

W

Z

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