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Produsen PCBA Satu Pintu/Daftar Istilah

Daftar Istilah PCB

Istilah dan daftar istilah dalam industri PCB & PCBA.

Dapatkan Penawaran Gratis

A

Acceptance Quality Level (AQL)Acceptance Test Access Holes Accuracy Acrylic Resin Activating Active Component Additive Process Adhesion Layer Adhesive Aging AIN Air Gap Algorithm Alkyd AlN Substrate Alumina Aluminium PCB Ambient American National Standards Institute (ANSI)American Wire Gauge (AWG)Analog Circuit Analog Circuit Simulator Analog Functional Test Analog In-circuit Test Analytical Services Lab Anchoring Spur Annotation Annular Ring Anode Anti-Solder Ball Any Layer Interstitial Via Hole (ALIVH)Aperture Aperture Information Aperture List Aperture Table Aperture Wheel Aqueous Cleaning Arc Resistance Array Array Rails Array X Dimension Array Y Dimension Artwork Artwork Master AS9100 ASCII ASCII Text Rasio Aspek Perakitan Assembly Drawing Assembly File Assembly House Assembly Language ASTM ATE Auto Router AutoCAD Automated Component Insertion Automated Optical Inspection (AOI)Automated Test Equipment (ATE)Automatic Component Placement Automatic X-Ray Inspection (AXI)Axial Lead Azeotrope

B

B-Stage B-Stage Material B-Stage Resin Back Drilling Backdriving Backpanel (Backplane)Backup Material Ball Grid Array (BGA)Bare Board Bare Board Test (BBT)Barrel Base Base Copper Base Copper Weight Base Laminate Base Material Base Material Thickness Base Solderability Basic Wettability Beam Lead Bed of Nails Bed of Nails Fixture Bellows Contact Bevel Beveled Edge Beveling BGA Assembly Bill of Materials Bill of Materials (BOM)Black Pad Blind Via Blister Blow Hole Bluetooth Blutter Coat Board Kepadatan Papan Rumah Papan Ketebalan Papan Jenis Papan (Unit Tunggal dan Panel)Vendor Papan Tubuh Emas Pengangkatan Obligasi Kekuatan Ikatan Lapisan Ikatan Waktu Ikatan Daerah Perbatasan Data Perbatasan Bantalan SMD Bawah Pemindaian Batas Busur Konduktor Bercabang Paduan Brazing Memisahkan diri Tegangan Rusak Pelarian Sambungan yang dijembatani Menjembatani BT-Epoxy Waktu Pembuatan (Lead Time)Penumpukan Kemampuan membangun Uji Mandiri Terpadu (BIST)Tonjolan Papan Perlawanan yang Terkubur Dimakamkan Via Burn-in Burr Bus Bus Bar Kapasitor Bypass

C

C-Stage Resin C-Stage C4 Kabel File CAD Sistem CAD File CAM CAM Hold Kapasitansi Kopling Kapasitif Aksi Kapiler Menangkap Konektor Tepi Kartu Perekat Tuang Lubang Castellated Catalyst Cathode Cavity Process CEM-1 Center to Center Spacing Ceramic Ball Grid Array (CBGA)Ceramic Substrate Printed Board Chamfer Check Plots Chemical Conversion Coating Chemical Hole Clearing Chemically-deposited Printed Chip on Board Chip Chip On Board (COB)Chip Scale Package (CSF)Chip Tester Circuit Circuit Board Circuit Card Circuit Card Assembly (CCA)Circuit Layer Circuit Tester Circumferential Separation Clad Clamshell Fixture Class 3 Clean Room Clearance Clearance Hole Clinched-wire through Connection Coated Copper Coating Coefficient of Expansion Coefficient of Thermal Expansion (CTE)Cold Solder Connection Collector Comparative Tracking Index (CTI)Compatibility Compiler Component Component Density Component Hole Component Kitting Component Library Component Side Component Sourcing Composite Epoxy Material (CEM)Computer Aided Design (CAD)Computer Aided Manufacturing (CAM)Computer Assisted Engineering (CAE)Computer Integrated Manufacturing (CIM)Computer Numerical Control (CNC)Conductive Adhesive Conductive Anodic Filament (CAF)Conductive Foil Conductive Pattern Conductor Conductor Base Width Conductor Layer Conductor Pattern Conductor Side Conductor Spacing Conductor Thickness Conductor Width Conductor-to-Hole Spacing Conformal Coat Conformal Coating Connection Connectivity Connector Connector Area Connector Tongue Contact Angle Contact Area Contact Resistance Contact Spacing Continuity Continuity Testing Continuous Outline Control Code Controlled Depth Drilling Controlled Dielectric Controlled Impedance Coordinate Tolerance Copper (Finished Copper)Copper (Finished Copper) Weight Copper Clad Copper Clad Laminate (CCL)Copper Foil Copper Foil (Base Copper Weight)Copper Pour Copper Thieving Berat Tembaga Core Thickness Corner Mark Corrosive Flux Cosmetic Defect Counterbore Counterbored Hole Countersink Coupon Cover Lay (Cover Coat)Cracking Crazing Creepage Crimp Contact Cross Hatching Cross-Linking Crosstalk CSP Cure Current Carrying Capacity Customer Part Number Cut Cut Lines Cut-and-clinch Cutouts Cycle Rate

D

D Code Database Date Code Datum Datum Reference Daughter Board De-bugging De-wetting Decal Defect Delamination Dendrite Design for Assembly (DFA)Design for manufacturing (DFM)Design Review (NRE)Design Rule Design Rule Check (DRC)Design Rule Checking (DRC)Design Width of Conductor Desktop Stencil Desmear Destructive Testing Develop Device Dewetting Dezincification DFSM Dicyandiamide (DICY)Die Die Bonder Die Bonding Dielectric Konstanta Dielektrik Kekuatan Dielektrik Sinyal Diferensial Pensinyalan Diferensial Sirkuit Digital Simulator Logika Digital Digitalisasi Stabilitas Dimensi Dioda DIP Komponen Diskrit Sambungan Solder Terganggu DNI DNP Penyimpanan Dokumen Dokumentasi DOS Berformat DOS Perakitan Dua Sisi Papan Dua Sisi Perakitan Komponen Dua Sisi Laminasi dua sisi PCB Dua Sisi Jalur Ganda Seret Solder Tarik keluar Menggambar Menggambar File Bor (File Bor Excellon)Bor Hit Inspeksi Alat Bor Pengeboran Latihan Dross Film Kering Masker Solder Film Kering (DFSM)Masker Solder Film Kering Waktu Pengeringan Gelombang Solder Ganda Komponen Dummy Durometer Format DXF Memori Akses Acak Dinamis (DRAM)

E

E-pad ECL Tepi Bevel Jarak Bebas Tepi Konektor Tepi Uji Kemampuan Solder Celup Tepi Pelapisan Tepi Jarak Tepi Konektor Papan Tepi Kekuatan Listrik Uji Listrik Deposisi Elektro Papan Cetak Tempel Elektrokonduktif Deposisi Elektroda Tembaga Tanpa Listrik Deposisi Tanpa Listrik Emas Perendaman Nikel Tanpa Elektrolit Tanpa Elektrolit (ENEPIG)Emas Perendaman Nikel Tanpa Listrik (ENIG)Ikatan berkas elektron Komponen Elektronik Elektroplating Tertanam Komponen Tertanam Jejak Tertanam EMC Emitor Kandang Desain dari ujung ke ujung Desain ujung ke ujung Bahan Masuk Pemeriksaan Stres Lingkungan Epoksi Resin Epoksi Epoxy Smear ERBGF ERC ESD Sensitivitas ESD ESR Etch Mengukir Kembali Kompensasi Etsa Faktor Etsa ETCH Resist Mengetsa kembali Etchant Papan Cetak Terukir Etsa Excellon File Bor Excellon Exotherm Lapisan Eksternal Siklus Tekan Ekstra Tembaga Asing Lubang

F

Luar biasa Fabrikasi Gambar Fabrikasi Perputaran Cepat Paparan Serat Fidusia Fiducial Mark File Submission Files Ivex Files Protel Fillet Film Artwork Fine Line Design Fine Pitch Finger Finished Copper First Article First Article Inspection First Pass Yield Fixed Frame Stencil Fixture Flash Gold Flat Flat Cable Flex Flex Circuit Flex PCB (Flexible PCB)Flexure Failure Flip Chip Flip Chip Flood Bar Flow Soldering Fluorocarbon Flush Conductor Flux Flux Residue Flux Residue Flying Probe Flying Probe Tester Flying Probe Tester Foil Footprint Footprint Forced-Air Convection FPC OUTLINE PROCESSING FR-1 FR-2 FR-4 FR-406 FR-408 FR-6 Frameless Stencil Fully-Additive Process Functional Testing (FCT)

G

G-10 Gas Blanket GC-Prevue Gerber File Gerber File Gerber Viewers GIL Grade MC3D GIL Grade MC3D Glass Transition Temperature (Tg)Glob Top Go/No-Go Test Gold Finger Gold Plated Gold/Nickel Plating Gold/Nickel plating Golden Board Grid Ground Ground Plane Ground Plane Clearance Gull Wing Lead

H

HAL Half-Cut/Castellated Holes Half-Holes PCB Halides Halogen-Free Halogenated Polyester Hard Copy Hard Gold HASL Finish PCB HDI Header Heat and Pull Heat Sink Heavy Copper PCB Hermetic High Density Interconnect (HDI)Hipot Test Hold-Down Tabs Hole Hole Breakout Hole Density Hole Location Hole Pattern Hole Pull Strength Hole Void Home Base Apertures Hot Air Solder Level (HASL)Hot Air Solder Leveling (HASL)HPGL Hybrid Hygroscopic

I

IC IEEE Image Imaging Pelapisan Perendaman Pelapisan Perendaman Perendaman Perak Timah Perendaman Impedansi Impedansi Kontrol Impedansi Pengujian Dalam Rangkaian (ICT)Penyertaan Rute Individu Tinta Inkjetting Lapisan Dalam Tempat Inspeksi Hamparan Inspeksi Institut Interkoneksi dan Pengemasan Sirkuit Elektronik (IPC)Resistensi Isolasi Sirkuit Terpadu (IC)Koneksi antar-wajah Sambungan Antar-lapisan Interkoneksi Uji Stres Interkoneksi Senyawa Intermetalik (IMC)Lapisan Internal Daya Internal dan Lapisan Tanah Lapisan Sinyal Internal Lubang Via Interstisial Klasifikasi IPC IPC-A-600 IPC-D-356 Isolasi

J

J-lead Penilaian Lompat Jumper Kawat Jumper Tepat waktu (JIT)

K

Kapton Pita Kapton Slot Penguncian (Slot Polarisasi)Alur pasak Dewan yang Dikenal Baik (KGB)

L

Laminasi Ketebalan Laminasi Laminasi Void Mesin Press Laminating Laminasi Tanah Pola Tanah Lubang Tanpa Tanah Laser Direct Imaging Laser Drilling Laser Photoplotter Laser soldering Lay-up Layer Layer Construction for Multilayer Designs Layer Sequence Layer-to-Layer Spacing LCCC Lead Free HASL Lead Projection Leakage Current Leakage Current Legenda LGA Library Lifted Land Lifted Land Line Line Space Line Width Liquation Liquid Photo-Imageable (LPI)Liquid Resist Liquids Load Test Logic Diagram Loss Tangent Loss Tangent Lot

M

Major Defect Manhattan Distance Manhattan Length Manufacturability Manufacturer Part Number (MPN)Kemampuan Manufaktur Mark Mask Master Drawing Master Pattern Materials for PCB Maximum Plated Through-hole Size MCM-L MCR Mean Time Between Failure (MTBF)Measling MELF Melting Range Membrane Switch Meniscus Metal Clad Base Material Metal Core Printed Circuit Board (MCPCB)Metal Electrical Face (MELF)Foil Logam Minimum Annular Ring (MAR)Lebar Konduktor Minimum Cincin Pembawa yang Dibentuk (MCR)

P

Pelapisan Panel Catatan Fabrikasi PCB (Catatan Fab)Rumah PCB Pengujian PCBA Pengujian PCBA Pitch Perakitan Papan Sirkuit Cetak (PCBA)

S

Bola Solder Teknologi Pemasangan Permukaan (SMT)

T

Lubang Perkakas Jejak dan Ruang Layanan Siap Pakai

V

Melalui Pengisian

W

Z

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