PCB Capabilities

Bester Tech PCB&PCBA Capabilities

PCB Fabrication Capabilities

PCB PROTOTYPE

Feature	Kemampuan
Kelas Kualitas	Standard IPC 1
Jumlah Lapisan	1 – 8 layers
Jumlah Pesanan	5 – 100pcs
Membangun Waktu	2 – 7 days
Bahan	FR-4 Standard Tg 140°C
Ukuran Papan	Min 6mm x 6mm Max 500mm x 500mm
Ketebalan Papan	0.4mm – 2.0mm
Berat Tembaga	1.0oz – 2.0oz
Min Tracing/Spacing	5mil/6mil (copper weight: 1oz) 8mil/8mil (copper weight: 2oz)
Sisi Masker Solder	Sesuai file
Warna Topeng Solder	Hijau, Putih, Biru, Hitam, Merah, Kuning
Sisi Silkscreen	Sesuai file
Silkscreen Color	White, Black
Permukaan akhir	Lead Free HASL – RoHS HASL – Hot Air Solder Leveling ENIG – Electroless Nickle/Immersion Gold – RoHS
Cincin Annular Min	5mil
Diameter Lubang Pengeboran Min	8mil
Lebar Minimum Potongan (NPTH)	0.8mm
Lebar Minimum Lubang Slot (PTH)	0.6mm
Ketebalan Pelapisan Permukaan / Lubang	20μm - 30μm
Rasio Aspek	10:1 (board thickness: hole size)
Tes	10V - 250V, probe terbang atau perlengkapan pengujian

RIGID PCB

Feature	Kemampuan
Kelas Kualitas	Standar IPC 2
Jumlah Lapisan	1 - 32 lapisan
Jumlah Pesanan	1 pc - 10.000.000 pcs
Membangun Waktu	2 hari - 5 minggu
Bahan	FR-4 Standar Tg 150°C, FR4-Tinggi Tg 170°C, FR4-Tinggi-Tg 180°C, FR4-Bebas Halogen, FR4-Bebas Halogen & Tg Tinggi
Ukuran Papan	Min 6mm x 6mm Max 600mm x 700mm
Ketebalan Papan	0.4mm - 3.2mm
Berat Tembaga	0.5oz - 6.0oz
Min Tracing/Spacing	3mil/3mil
Sisi Masker Solder	Sesuai file
Warna Topeng Solder	Hijau, Putih, Biru, Hitam, Merah, Kuning
Sisi Silkscreen	Sesuai file
Permukaan akhir	HASL – Hot Air Solder Leveling Lead Free HASL – RoHS ENIG – Electroless Nickle/Immersion Gold – RoHS ENEPIG – Electroless Nickel Electroless Palladium Immersion Gold – RoHS Immersion Silver – RoHS Immersion Tin – RoHS OSP -Organic Solderability Preservatives – RoHS
Cincin Annular Min	3mil
Diameter Lubang Pengeboran Min	Bor laser 6 mil, 4 mil
Lebar Minimum Potongan (NPTH)	0.8mm
Lebar Minimum Lubang Slot (PTH)	0.6mm
Ketebalan Pelapisan Permukaan / Lubang	20μm - 30μm
Rasio Aspek	1:10 (ukuran lubang: ketebalan papan)
Tes	10V - 250V, probe terbang atau perlengkapan pengujian
Toleransi impedansi	±5% - ±10%
Pitch SMD	0,2 mm (8 mil)
BGA Pitch	0,2 mm (8 mil)
Talang Jari Emas	20, 30, 45, 60
Teknik Lainnya	Gold fingers Blind and Buried Holes peelable solder mask Edge plating Carbon Mask Pita Kapton Countersink/counterbore hole Half-cut/Castellated hole Press fit hole Via tented/covered with resin Via plugged/filled with resin Via in pad Uji Listrik

FLEXIBLE PCB

Feature	Kemampuan
Kelas Kualitas	Standar IPC 2
Jumlah Lapisan	1 – 8layers
Jumlah Pesanan	1pc – 10000+pcs
Membangun Waktu	2 hari - 5 minggu
Bahan	DuPont PI, Domestic Shengyi PI
Ukuran Papan	Min 6mm x 6mm Max 406mm x 610mm
Ketebalan Papan	0.1mm – 0.8mm
Copper Weight (Finished)	0.5oz – 2.0oz
Min Tracing/Spacing	3mil/3mil
Sisi Masker Solder	Sesuai file
Warna Topeng Solder	Hijau, Putih, Biru, Hitam, Merah, Kuning
Solder-stop coating—Soldermask oil	Hijau, Putih, Biru, Hitam, Merah, Kuning
Solder-stop coating—Coverlay	PI and PET film
Sisi Silkscreen	Sesuai file
Silkscreen Color	White, Black, Yellow
Permukaan akhir	HASL – Hot air solder leveling Lead – free HASL – RoHS ENIG – RoHS Immersion Tin – RoHS OSP – RoHS
Cincin Annular Min	4mil
Diameter Lubang Pengeboran Min	8mil
Min. hole size—Drilling (PTH)	0.2mil
Min. hole size—Punching (NPTH)	0.5mil
Tolerance of dimension	±0.05mm
Teknik Lainnya	Peelable solder mask Gold fingers Stiffener (only for PI/FR4 substrate)

RIGID-FLEX PCB

Feature	Kemampuan
Kelas Kualitas	Standar IPC 2
Jumlah Lapisan	2 – 24layers
Jumlah Pesanan	1pc – 10000+pcs
Membangun Waktu	2 hari - 5 minggu
Bahan	DuPont (PI25UM), FR4
Ukuran Papan	Min 6mm x 6mm Max 457mm x 610mm
Ketebalan Papan	0.6mm – 5.0mm
Copper Weight (Finished)	0.5oz – 2.0oz
Min Tracing/Spacing	3mil/3mil
Sisi Masker Solder	Sesuai file
Warna Topeng Solder	Hijau, Putih, Biru, Hitam, Merah, Kuning
Sisi Silkscreen	Sesuai file
Silkscreen Color	White, Black, Yellow
Permukaan akhir	HASL – Hot air solder leveling Lead – free HASL – RoHS ENIG – RoHS
Cincin Annular Min	4mil
Diameter Lubang Pengeboran Min	8mil
Impedance control	±10%
Teknik Lainnya	HDI Gold fingers Stiffener (only for PI/FR4 substrate)

ALUMINUM PCB

Feature	Kemampuan
Kelas Kualitas	Standar IPC 2
Jumlah Lapisan	4 – 24layers
Jumlah Pesanan	1pc – 10000+pcs
Membangun Waktu	2 hari - 5 minggu
Bahan	Aluminum core (Domestic 1060), Copper core, FR4 covering
Ukuran Papan	Min 6mm x 6mm Max 610mm x 610mm
Ketebalan Papan	0.8mm – 5.0mm
Copper Weight (Finished)	0.5oz – 10.0oz
Min Tracing/Spacing	4mil/4mil
Sisi Masker Solder	Sesuai file
Warna Topeng Solder	Hijau, Putih, Biru, Hitam, Merah, Kuning
Sisi Silkscreen	Sesuai file
Silkscreen Color	White, Black, Yellow
Permukaan akhir	HASL – Hot Air Solder Leveling Lead Free HASL – RoHS ENIG – Electroless Nickle/Immersion Gold – RoHS
Cincin Annular Min	4mil
Diameter Lubang Pengeboran Min	6mil
Teknik Lainnya	Countersink holes Screw holes

PCB HDI

Feature	Kemampuan
Kelas Kualitas	Standar IPC 2
Jumlah Lapisan	4 – 24layers
Jumlah Pesanan	1pc – 10000+pcs
Membangun Waktu	2 hari - 5 minggu
Bahan	FR4 standard Tg 140°C,FR4 High Tg 170°C, FR4 and Rogers combined lamination
Ukuran Papan	Min 66mm \| Max 457610mm
Ketebalan Papan	0.4mm – 3.0mm
Copper Weight (Finished)	0.5oz – 2.0oz
Min Tracing/Spacing	2.5mil/2.5mil
Sisi Masker Solder	Sesuai file
Warna Topeng Solder	Hijau, Putih, Biru, Hitam, Merah, Kuning
Sisi Silkscreen	Sesuai file
Silkscreen Color	White, Black, Yellow
Permukaan akhir	HASL – Hot Air Solder Leveling Lead Free HASL – RoHS ENIG – Electroless Nickle/Immersion Gold – RoHS Immersion Silver – RoHS Immersion Tin – RoHS OSP – Organic Solderability Preservatives – RoHS
Cincin Annular Min	4mil, 3mil – laser drill
Diameter Lubang Pengeboran Min	6mil, 4mil – laser drill
Max Exponents of Blind/Buried Vias	stacked vias for 3 layers interconnected, staggered vias for 4 layers interconnected
Teknik Lainnya	Flex-rigid combination Via In Pad Buried Capacitor (only for Prototype PCB total area ≤1m²)

HIGH FREQUENCY PCB

Feature	Kemampuan
Kelas Kualitas	Standar IPC 2
Jumlah Lapisan	4 – 24layers
Jumlah Pesanan	1pc – 10000+pcs
Membangun Waktu	2 hari - 5 minggu
Bahan	RO4003C, RO4350B, Ro3003, Ro3010, RT5880
PP	Rogers 4450F, Domestic-(25FR), Domestic-(RF-27), Domestic-(6700)
Ukuran Papan	Min 6mm x 6mm Max 457mm x 610mm
Ketebalan Papan	0.4mm – 5.0mm
Copper Weight (Finished)	0.5oz – 2.0oz
Min Tracing/Spacing	3mil/3mil
Sisi Masker Solder	Sesuai file
Warna Topeng Solder	Hijau, Putih, Biru, Hitam, Merah, Kuning
Sisi Silkscreen	Sesuai file
Silkscreen Color	White, Black, Yellow
Permukaan akhir	Electroless nickel/immersion gold (ENIG) – RoHS Immersion silver – RoHS Immersion tin – RoHS Organic solderability preservatives – RoHS
Cincin Annular Min	4mil
Diameter Lubang Pengeboran Min	6mil
Toleransi impedansi	±10%
Teknik Lainnya	Peelable solder mask Gold fingers Carbon oil Countersink holes

PCB Assembly Capabilities

Fabrikasi PCB

Feature	Kemampuan
Spesifikasi Papan Sirkuit	Maximum Panel size: 19.7″ x 31.5″ Maximum Number of Layers: 1-40 Copper Thickness: 0.5 oz to 5.0 oz Minimum Line Width: 3 mil Minimum Line spacing: 3 mil Smallest Hole: 0.006″ Blind, Buried and plugged Vias Controlled impedance
Bahan	Thickness: 0.008″ to 0.240″ FR-4 High TG FR-4 PTFE Aluminum Base Rogers Specialized material per your request
Masker Solder	LPI – Green, Yellow, Black, Red, Blue, White, etc. (Inquire for more options) Peelable Mask
Penyelesaian Akhir	SMOBC (HASL) Carbon Selective Gold Plating Hard and Soft Gold Immersion Gold Perendaman Perak Timah Perendaman OSP
Legenda	Putih, Kuning, Hitam (Tanyakan untuk opsi lainnya)
Metode Inspeksi	100% Visual inspection Electrical testing – Flying probe or Nails Bed Sample lot inspection Cross sectioning
Pengiriman	Rush: 24 Hours Standard Prototype: 5 days Standard Production: 10 days

PCB ASSEMBLY

Feature	Kemampuan
Jenis Perakitan	THD (Perangkat Melalui Lubang) SMT (Teknologi Pemasangan di Permukaan) Campuran SMT & THD Perakitan SMT dan THD 2 sisi
Order quantity	1 to 10,000 boards
Komponen	Bagian pasif, ukuran terkecil 0201 Pitch halus hingga 8 Mil Chip BGA, uBGA, QFN, POP, dan Tanpa Timbal Konektor dan terminal
Paket Komponen	Gulungan Potong selotip Tabung dan baki Bagian yang longgar dan curah
Board dimensions	Ukuran terkecil: 0,2 ″ x 0,2 ″ Ukuran terbesar: 15″ x 20″Putih, Kuning, Hitam (Tanyakan untuk opsi lainnya)
Board shape	Persegi panjang Bulat Slot dan Potongan Kompleks dan Tidak Teratur
Board type	FR-4 yang kaku Papan yang kaku dan fleksibel
Assembly process	Proses bertimbal Bebas Timbal (RoHS)
Design file format	Gerber RS-274X BOM (Bill of Material) (.xls, .csv, . xlsx) Centroid (Pilih-N-Tempat / File XY)
Sales and support	Emails Phone calls Web online quotation for PCB and assembly
Electrical testing	X-ray Inspection AOI (Inspeksi Optik Otomatis) Functional testing
Oven profile	Standard Custom
Turnaround time	1-5 hari hanya untuk perakitan PCB 10-16 hari untuk perakitan PCB siap pakai