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One Stop PCBA Manufacturer/Glossary

PCB Glossary

Terms and glossary in PCB & PCBA industry.

A

Acceptance Quality Level (AQL)Acceptance Test Access Holes Accuracy Acrylic Resin Activating Active Component Additive Process Adhesion Layer Adhesive Aging AIN Air Gap Algorithm Alkyd AlN Substrate Alumina Aluminum PCB Ambient American National Standards Institute (ANSI)American Wire Gauge (AWG)Analog Circuit Analog Circuit Simulator Analog Functional Test Analog In-circuit Test Analytical Services Lab Anchoring Spur Annotation Annular Ring Anode Anti-Solder Ball Any Layer Interstitial Via Hole (ALIVH)Aperture Aperture Information Aperture List Aperture Table Aperture Wheel Aqueous Cleaning Arc Resistance Array Array Rails Array X Dimension Array Y Dimension Artwork Artwork Master AS9100 ASCII ASCII Text Aspect Ratio Assembly Assembly Drawing Assembly File Assembly House Assembly Language ASTM ATE Auto Router AutoCAD Automated Component Insertion Automated Optical Inspection (AOI)Automated Test Equipment (ATE)Automatic Component Placement Automatic X-Ray Inspection (AXI)Axial Lead Azeotrope

B

B-Stage B-Stage Material B-Stage Resin Back Drilling Backdriving Backpanel (Backplane)Backup Material Ball Grid Array (BGA)Bare Board Bare Board Test (BBT)Barrel Base Base Copper Base Copper Weight Base Laminate Base Material Base Material Thickness Base Solderability Basic Wettability Beam Lead Bed of Nails Bed of Nails Fixture Bellows Contact Bevel Beveled Edge Beveling BGA Assembly Bill of Materials Bill of Materials (BOM)Black Pad Blind Via Blister Blow Hole Bluetooth Blutter Coat Board Board Density Board House Board Thickness Board Type (Single Unit and Panel)Board Vendor Body Gold Bond Lift-off Bond Strength Bonding Layer Bonding Time Border Area Border Data Bottom SMD Pad Boundary Scan Bow Branched Conductor Brazing Alloy Break-away Breakdown Voltage Breakout Bridged Joint Bridging BT-Epoxy Build Time (Lead Time)Build-up Buildability Built-In Self-Test (BIST)Bulge Buried Resistance Board Buried Via Burn-in Burr Bus Bus Bar Bypass Capacitor

C

C-Stage C-Stage Resin C4 Cable CAD file CAD system CAM File CAM Hold Capacitance Capacitive Coupling Capillary Action Capture Card-Edge Connector Cast Adhesive Castellated Hole Catalyst Cathode Cavity Process CEM-1 Center to Center Spacing Ceramic Ball Grid Array (CBGA)Ceramic Substrate Printed Board Chamfer Check Plots Chemical Conversion Coating Chemical Hole Clearing Chemically-deposited Printed Chip on Board Chip Chip On Board (COB)Chip Scale Package (CSF)Chip Tester Circuit Circuit Board Circuit Card Circuit Card Assembly (CCA)Circuit Layer Circuit Tester Circumferential Separation Clad Clamshell Fixture Class 3 Clean Room Clearance Clearance Hole Clinched-wire through Connection Coated Copper Coating Coefficient of Expansion Coefficient of Thermal Expansion (CTE)Cold Solder Connection Collector Comparative Tracking Index (CTI)Compatibility Compiler Component Component Density Component Hole Component Kitting Component Library Component Side Component Sourcing Composite Epoxy Material (CEM)Computer Aided Design (CAD)Computer Aided Manufacturing (CAM)Computer Assisted Engineering (CAE)Computer Integrated Manufacturing (CIM)Computer Numerical Control (CNC)Conductive Adhesive Conductive Anodic Filament (CAF)Conductive Foil Conductive Pattern Conductor Conductor Base Width Conductor Layer Conductor Pattern Conductor Side Conductor Spacing Conductor Thickness Conductor Width Conductor-to-Hole Spacing Conformal Coat Conformal Coating Connection Connectivity Connector Connector Area Connector Tongue Contact Angle Contact Area Contact Resistance Contact Spacing Continuity Continuity Testing Continuous Outline Control Code Controlled Depth Drilling Controlled Dielectric Controlled Impedance Coordinate Tolerance Copper (Finished Copper)Copper (Finished Copper) Weight Copper Clad Copper Clad Laminate (CCL)Copper Foil Copper Foil (Base Copper Weight)Copper Pour Copper Thieving Copper Weight Core Thickness Corner Mark Corrosive Flux Cosmetic Defect Counterbore Counterbored Hole Countersink Coupon Cover Lay (Cover Coat)Cracking Crazing Creepage Crimp Contact Cross Hatching Cross-Linking Crosstalk CSP Cure Current Carrying Capacity Customer Part Number Cut Cut Lines Cut-and-clinch Cutouts Cycle Rate

D

D Code Database Date Code Datum Datum Reference Daughter Board De-bugging De-wetting Decal Defect Delamination Dendrite Design for Assembly (DFA)Design for manufacturing (DFM)Design Review (NRE)Design Rule Design Rule Check (DRC)Design Rule Checking (DRC)Design Width of Conductor Desktop Stencil Desmear Destructive Testing Develop Device Dewetting Dezincification DFSM Dicyandiamide (DICY)Die Die Bonder Die Bonding Dielectric Dielectric Constant Dielectric Strength Differential Signal Differential Signaling Digital Circuit Digital Logic Simulator Digitizing Dimensional Stability Diode DIP Discrete Component Disturbed Solder Connection DNI DNP Document Retention Documentation DOS DOS-formatted Double-Sided Assembly Double-Sided Board Double-sided Component Assembly Double-sided Laminate Double-Sided PCB Double-Track Drag Soldering Drag-out Draw Draw Drill File (Excellon Drill File)Drill Hits Drill Tool Inspection Drilling Drills Dross Dry Film Dry Film Solder Mask (DFSM)Dry Film Soldermask Drying Time Dual Solder Wave Dummy Component Durometer DXF format Dynamic Random Access Memory (DRAM)

E

E-pad ECL Edge Bevel Edge Clearance Edge Connector Edge Dip Solderability Test Edge Plating Edge Spacing Edge-Board Connector Electrical Strength Electrical Test Electro Deposition Electroconductive Paste Printed Board Electrode Deposition Electroless Copper Electroless Deposition Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG)Electroless Nickel Immersion Gold (ENIG)Electron-beam Bonding Electronic Component Electroplating Embedded Embedded Component Embedded Traces EMC Emitter Enclosures End-to-end Design End-to-end design Entry Material Environmental Stress Screening Epoxy Epoxy Resins Epoxy Smear ERBGF ERC ESD ESD Sensitivity ESR Etch Etch Back Etch Compensation Etch Factor ETCH Resist Etch-back Etchant Etched Printed Board Etching Excellon Excellon Drill File Exotherm External Layer Extra Press Cycles Extraneous Copper Eyelet

F

Fab Fabrication Fabrication Drawing Fast Turnaround Fibre Exposure Fiducial Fiducial Mark File Submission Files Ivex Files Protel Fillet Film Artwork Fine Line Design Fine Pitch Finger Finished Copper First Article First Article Inspection First Pass Yield Fixed Frame Stencil Fixture Flash Gold Flat Flat Cable Flex Flex Circuit Flex PCB (Flexible PCB)Flexure Failure Flip Chip Flip Chip Flood Bar Flow Soldering Fluorocarbon Flush Conductor Flux Flux Residue Flux Residue Flying Probe Flying Probe Tester Flying Probe Tester Foil Footprint Footprint Forced-Air Convection FPC OUTLINE PROCESSING FR-1 FR-2 FR-4 FR-406 FR-408 FR-6 Frameless Stencil Fully-Additive Process Functional Testing (FCT)

G

G-10 Gas Blanket GC-Prevue Gerber File Gerber File Gerber Viewers GIL Grade MC3D GIL Grade MC3D Glass Transition Temperature (Tg)Glob Top Go/No-Go Test Gold Finger Gold Plated Gold/Nickel Plating Gold/Nickel plating Golden Board Grid Ground Ground Plane Ground Plane Clearance Gull Wing Lead

H

HAL Half-Cut/Castellated Holes Half-Holes PCB Halides Halogen-Free Halogenated Polyester Hard Copy Hard Gold HASL Finish HDI PCB Header Heat and Pull Heat Sink Heavy Copper PCB Hermetic High Density Interconnect (HDI)Hipot Test Hold-Down Tabs Hole Hole Breakout Hole Density Hole Location Hole Pattern Hole Pull Strength Hole Void Home Base Apertures Hot Air Solder Level (HASL)Hot Air Solder Leveling (HASL)HPGL Hybrid Hygroscopic

I

IC IEEE Image Imaging Immersion Coating Immersion Plating Immersion Silver Immersion Tin Impedance Impedance Impedance Control In-circuit Testing (ICT)Inclusion Individual Route Ink Inkjetting Inner Layer Inspection Lot Inspection Overlay Institute for Interconnecting and Packaging Electronic Circuits (IPC)Insulation Resistance Integrated Circuits (IC)Inter-facial Connection Inter-layer Connection Interconnect Interconnect Stress Test Intermetallic Compounds (IMC)Internal Layer Internal Power and Ground Layers Internal Signal Layers Interstitial Via Hole IPC Classification IPC-A-600 IPC-D-356 Isolation

J

J-leads Jump Scoring Jumper Jumper Wire Just-in-time (JIT)

K

Kapton Kapton tape Keying Slot (Polarizing Slot)Keyway Known Good Board (KGB)

L

Laminate Laminate Thickness Laminate Void Laminating Press Lamination Land Land Pattern Landless Hole Laser Direct Imaging Laser Drilling Laser Photoplotter Laser soldering Lay-up Layer Layer Construction for Multilayer Designs Layer Sequence Layer-to-Layer Spacing LCCC Lead Free HASL Lead Projection Leakage Current Leakage Current Legend LGA Library Lifted Land Lifted Land Line Line Space Line Width Liquation Liquid Photo-Imageable (LPI)Liquid Resist Liquids Load Test Logic Diagram Loss Tangent Loss Tangent Lot

M

Major Defect Manhattan Distance Manhattan Length Manufacturability Manufacturer Part Number (MPN)Manufacturing Capabilities Mark Mask Master Drawing Master Pattern Materials for PCB Maximum Plated Through-hole Size MCM-L MCR Mean Time Between Failure (MTBF)Measling MELF Melting Range Membrane Switch Meniscus Metal Clad Base Material Metal Core Printed Circuit Board (MCPCB)Metal Electrical Face (MELF)Metal Foil Minimum Annular Ring (MAR)Minimum Conductor Width Molded Carrier Ring (MCR)

P

Panel Plating PCB Fabrication Notes (Fab Notes)PCB House PCBA Testing PCBA Testing Pitch Printed Circuit Board Assembly (PCBA)

S

Solder Balls Surface Mount Technology (SMT)

T

Tooling Hole Traces and Spaces Turnkey Service

V

W

Z

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