What is High Density Interconnect (HDI)

What is High Density Interconnect (HDI)

High Density Interconnect (HDI) describes a type of printed circuit board that achieves a higher wiring density per unit area compared to traditional PCBs. HDI PCBs are designed to meet the growing demand for smaller, faster electronic products.

HDI PCBs incorporate various features to achieve their high density. These features include microvias, blind and buried vias, built-up laminations, and considerations for high signal performance. Microvias are small holes drilled into the PCB that allow for the routing of traces between different layers, while blind and buried vias connect the outer layers of the board to internal layers. These features enable the placement of a large number of components and interconnections in a smaller space.

HDI PCBs allow for the consolidation of multiple traditional PCBs into a single HDI PCB, resulting in lighter weight, more compact, and lower layer count boards. The smaller vias, pads, copper traces, and spaces in HDI PCBs enable denser wiring, which leads to improved performance and reduced power consumption. Additionally, HDI PCBs offer better signal integrity, lower RFI/EMI, and distributed capacitance.

HDI PCBs find applications in various industries and electronic devices that require high performance in a limited space, including mobile phones, laptops, digital cameras, network communications, automotive and aerospace industries, medical devices, industrial automation, and the Internet of Things (IoT).