PCB Capabilities
Bester Tech PCB&PCBA Capabilities
PCB Fabrication Capabilities
| Feature | Capabilities |
|---|---|
| Quality Grade | Standard IPC 1 |
| Number of Layers | 1 – 8 layers |
| Order Quantity | 5 – 100pcs |
| Build Time | 2 – 7 days |
| Material | FR-4 Standard Tg 140°C |
| Board Size | Min 6mm x 6mm Max 500mm x 500mm |
| Board Thickness | 0.4mm – 2.0mm |
| Copper Weight | 1.0oz – 2.0oz |
| Min Tracing/Spacing | 5mil/6mil (copper weight: 1oz) 8mil/8mil (copper weight: 2oz) |
| Solder Mask Sides | As per the file |
| Solder Mask Color | Green, White, Blue, Black, Red, Yellow |
| Silkscreen Sides | As per the file |
| Silkscreen Color | White, Black |
| Surface Finish | Lead Free HASL – RoHS HASL – Hot Air Solder Leveling ENIG – Electroless Nickle/Immersion Gold – RoHS |
| Min Annular Ring | 5mil |
| Min Drilling Hole Diameter | 8mil |
| Min Width of Cutout (NPTH) | 0.8mm |
| Min Width of Slot Hole (PTH) | 0.6mm |
| Surface/Hole Plating Thickness | 20μm – 30μm |
| Aspect Ratio | 10:1 (board thickness: hole size) |
| Test | 10V – 250V, flying probe or testing fixture |
| Feature | Capabilities |
|---|---|
| Quality Grade | Standard IPC 2 |
| Number of Layers | 1 – 32layers |
| Order Quantity | 1pc – 10,000,000 pcs |
| Build Time | 2days – 5weeks |
| Material | FR-4 Standard Tg 150°C, FR4-High Tg 170°C, FR4-High-Tg 180°C, FR4-Halogen-free, FR4-Halogen-free & High-Tg |
| Board Size | Min 6mm x 6mm Max 600mm x 700mm |
| Board Thickness | 0.4mm – 3.2mm |
| Copper Weight | 0.5oz – 6.0oz |
| Min Tracing/Spacing | 3mil/3mil |
| Solder Mask Sides | As per the file |
| Solder Mask Color | Green, White, Blue, Black, Red, Yellow |
| Silkscreen Sides | As per the file |
| Surface Finish | HASL – Hot Air Solder Leveling Lead Free HASL – RoHS ENIG – Electroless Nickle/Immersion Gold – RoHS ENEPIG – Electroless Nickel Electroless Palladium Immersion Gold – RoHS Immersion Silver – RoHS Immersion Tin – RoHS OSP -Organic Solderability Preservatives – RoHS |
| Min Annular Ring | 3mil |
| Min Drilling Hole Diameter | 6mil, 4mil-laser drill |
| Min Width of Cutout (NPTH) | 0.8mm |
| Min Width of Slot Hole (PTH) | 0.6mm |
| Surface/Hole Plating Thickness | 20μm – 30μm |
| Aspect Ratio | 1:10 (hole size: board thickness) |
| Test | 10V – 250V, flying probe or testing fixture |
| Impedance tolerance | ±5% – ±10% |
| SMD Pitch | 0.2mm(8mil) |
| BGA Pitch | 0.2mm(8mil) |
| Chamfer of Gold Fingers | 20, 30, 45, 60 |
| Other Techniques | Gold fingers Blind and Buried Holes peelable solder mask Edge plating Carbon Mask Kapton tape Countersink/counterbore hole Half-cut/Castellated hole Press fit hole Via tented/covered with resin Via plugged/filled with resin Via in pad Electrical Test |
| Feature | Capabilities |
|---|---|
| Quality Grade | Standard IPC 2 |
| Number of Layers | 1 – 8layers |
| Order Quantity | 1pc – 10000+pcs |
| Build Time | 2days – 5weeks |
| Material | DuPont PI, Domestic Shengyi PI |
| Board Size | Min 6mm x 6mm Max 406mm x 610mm |
| Board Thickness | 0.1mm – 0.8mm |
| Copper Weight (Finished) | 0.5oz – 2.0oz |
| Min Tracing/Spacing | 3mil/3mil |
| Solder Mask Sides | As per the file |
| Solder Mask Color | Green, White, Blue, Black, Red, Yellow |
| Solder-stop coating—Soldermask oil | Green, White, Blue, Black, Red, Yellow |
| Solder-stop coating—Coverlay | PI and PET film |
| Silkscreen Sides | As per the file |
| Silkscreen Color | White, Black, Yellow |
| Surface Finish | HASL – Hot air solder leveling Lead – free HASL – RoHS ENIG – RoHS Immersion Tin – RoHS OSP – RoHS |
| Min Annular Ring | 4mil |
| Min Drilling Hole Diameter | 8mil |
| Min. hole size—Drilling (PTH) | 0.2mil |
| Min. hole size—Punching (NPTH) | 0.5mil |
| Tolerance of dimension | ±0.05mm |
| Other Techniques | Peelable solder mask Gold fingers Stiffener (only for PI/FR4 substrate) |
| Feature | Capabilities |
|---|---|
| Quality Grade | Standard IPC 2 |
| Number of Layers | 2 – 24layers |
| Order Quantity | 1pc – 10000+pcs |
| Build Time | 2days – 5weeks |
| Material | DuPont (PI25UM), FR4 |
| Board Size | Min 6mm x 6mm Max 457mm x 610mm |
| Board Thickness | 0.6mm – 5.0mm |
| Copper Weight (Finished) | 0.5oz – 2.0oz |
| Min Tracing/Spacing | 3mil/3mil |
| Solder Mask Sides | As per the file |
| Solder Mask Color | Green, White, Blue, Black, Red, Yellow |
| Silkscreen Sides | As per the file |
| Silkscreen Color | White, Black, Yellow |
| Surface Finish | HASL – Hot air solder leveling Lead – free HASL – RoHS ENIG – RoHS |
| Min Annular Ring | 4mil |
| Min Drilling Hole Diameter | 8mil |
| Impedance control | ±10% |
| Other Techniques | HDI Gold fingers Stiffener (only for PI/FR4 substrate) |
| Feature | Capabilities |
|---|---|
| Quality Grade | Standard IPC 2 |
| Number of Layers | 4 – 24layers |
| Order Quantity | 1pc – 10000+pcs |
| Build Time | 2days – 5weeks |
| Material | Aluminum core (Domestic 1060), Copper core, FR4 covering |
| Board Size | Min 6mm x 6mm Max 610mm x 610mm |
| Board Thickness | 0.8mm – 5.0mm |
| Copper Weight (Finished) | 0.5oz – 10.0oz |
| Min Tracing/Spacing | 4mil/4mil |
| Solder Mask Sides | As per the file |
| Solder Mask Color | Green, White, Blue, Black, Red, Yellow |
| Silkscreen Sides | As per the file |
| Silkscreen Color | White, Black, Yellow |
| Surface Finish | HASL – Hot Air Solder Leveling Lead Free HASL – RoHS ENIG – Electroless Nickle/Immersion Gold – RoHS |
| Min Annular Ring | 4mil |
| Min Drilling Hole Diameter | 6mil |
| Other Techniques | Countersink holes Screw holes |
| Feature | Capabilities |
|---|---|
| Quality Grade | Standard IPC 2 |
| Number of Layers | 4 – 24layers |
| Order Quantity | 1pc – 10000+pcs |
| Build Time | 2days – 5weeks |
| Material | FR4 standard Tg 140°C,FR4 High Tg 170°C, FR4 and Rogers combined lamination |
| Board Size | Min 6*6mm | Max 457*610mm |
| Board Thickness | 0.4mm – 3.0mm |
| Copper Weight (Finished) | 0.5oz – 2.0oz |
| Min Tracing/Spacing | 2.5mil/2.5mil |
| Solder Mask Sides | As per the file |
| Solder Mask Color | Green, White, Blue, Black, Red, Yellow |
| Silkscreen Sides | As per the file |
| Silkscreen Color | White, Black, Yellow |
| Surface Finish | HASL – Hot Air Solder Leveling Lead Free HASL – RoHS ENIG – Electroless Nickle/Immersion Gold – RoHS Immersion Silver – RoHS Immersion Tin – RoHS OSP – Organic Solderability Preservatives – RoHS |
| Min Annular Ring | 4mil, 3mil – laser drill |
| Min Drilling Hole Diameter | 6mil, 4mil – laser drill |
| Max Exponents of Blind/Buried Vias | stacked vias for 3 layers interconnected, staggered vias for 4 layers interconnected |
| Other Techniques | Flex-rigid combination Via In Pad Buried Capacitor (only for Prototype PCB total area ≤1m²) |
| Feature | Capabilities |
|---|---|
| Quality Grade | Standard IPC 2 |
| Number of Layers | 4 – 24layers |
| Order Quantity | 1pc – 10000+pcs |
| Build Time | 2days – 5weeks |
| Material | RO4003C, RO4350B, Ro3003, Ro3010, RT5880 |
| PP | Rogers 4450F, Domestic-(25FR), Domestic-(RF-27), Domestic-(6700) |
| Board Size | Min 6mm x 6mm Max 457mm x 610mm |
| Board Thickness | 0.4mm – 5.0mm |
| Copper Weight (Finished) | 0.5oz – 2.0oz |
| Min Tracing/Spacing | 3mil/3mil |
| Solder Mask Sides | As per the file |
| Solder Mask Color | Green, White, Blue, Black, Red, Yellow |
| Silkscreen Sides | As per the file |
| Silkscreen Color | White, Black, Yellow |
| Surface Finish | Electroless nickel/immersion gold (ENIG) – RoHS Immersion silver – RoHS Immersion tin – RoHS Organic solderability preservatives – RoHS |
| Min Annular Ring | 4mil |
| Min Drilling Hole Diameter | 6mil |
| Impedance tolerance | ±10% |
| Other Techniques | Peelable solder mask Gold fingers Carbon oil Countersink holes |
PCB Assembly Capabilities
| Feature | Capabilities |
|---|---|
| Circuit Board Specifications | Maximum Panel size: 19.7″ x 31.5″ Maximum Number of Layers: 1-40 Copper Thickness: 0.5 oz to 5.0 oz Minimum Line Width: 3 mil Minimum Line spacing: 3 mil Smallest Hole: 0.006″ Blind, Buried and plugged Vias Controlled impedance |
| Material | Thickness: 0.008″ to 0.240″ FR-4 High TG FR-4 PTFE Aluminum Base Rogers Specialized material per your request |
| Solder Mask | LPI – Green, Yellow, Black, Red, Blue, White, etc. (Inquire for more options) Peelable Mask |
| Final Finishes | SMOBC (HASL) Carbon Selective Gold Plating Hard and Soft Gold Immersion Gold Immersion Silver Immersion Tin OSP |
| Legend | White, Yellow, Black (Inquire for more options) |
| Inspection Methods | 100% Visual inspection Electrical testing – Flying probe or Nails Bed Sample lot inspection Cross sectioning |
| Delivery | Rush: 24 Hours Standard Prototype: 5 days Standard Production: 10 days |
| Feature | Capabilities |
|---|---|
| Types of Assembly | THD (Thru-Hole Device) SMT (Surface-Mount Technology) SMT & THD mixed 2 sided SMT and THD assembly |
| Order quantity | 1 to 10,000 boards |
| Components | Passives parts, smallest size 0201 Fine pitch to 8 Mils BGA, uBGA, QFN,POP and Leadless chips Connectors and terminals |
| Component Package | Reels Cut tape Tube and tray Loose parts and bulk |
| Board dimensions | Smallest size: 0.2″ x 0.2″ Largest size: 15″ x 20″White, Yellow, Black (Inquire for more options) |
| Board shape | Rectangular Round Slots and Cut outs Complex and Irregular |
| Board type | Rigid FR-4 Rigid-Flex boards |
| Assembly process | Leaded process Lead-Free (RoHS) |
| Design file format | Gerber RS-274X BOM (Bill of Materials) (.xls, .csv, . xlsx) Centroid (Pick-N-Place/XY file) |
| Sales and support | Emails Phone calls Web online quotation for PCB and assembly |
| Electrical testing | X-ray Inspection AOI (Automated Optical Inspection) Functional testing |
| Oven profile | Standard Custom |
| Turnaround time | 1-5 days for only PCB assembly 10-16 days for turnkey PCB assembly |
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